Yayin da ci gaban masana'antar PCB ke karuwa a hankali da haɓaka haɓaka aikace-aikacen AI, buƙatar PCBs uwar garken yana ci gaba da ƙarfafawa. Daga cikin su, fasahar High-Density Interconnect (HDI), musamman kayayyakin HDI da ke samun haɗin kai na lantarki tsakanin sassan allo ta amfani da ƙananan makafi ta hanyar fasaha, suna samun kulawa sosai.

Da yawa daga cikin kamfanonin da aka jera sun nuna cewa sun fara zaɓar yuwuwar umarni don samarwa, kuma kamfanoni da yawa suna sanya kansu tare da samfuran da suka shafi AI. Manazarta kasuwa sun yi hasashen cewa buƙatun PCBs na sabobin AI yana canzawa zuwa fasahar HDI gabaɗaya, kuma ana tsammanin amfani da HDI zai ƙaru sosai a nan gaba.

A cewar labarai na kasuwa, an saita sabar GB200 na Nvidia don shiga samarwa a hukumance a rabin na biyu na shekara, tare da buƙatar PCBs na sabobin AI wanda ke mai da hankali musamman kan rukunin hukumar GPU. Saboda babban buƙatun saurin watsawa na sabar AI, allunan HDI da ake buƙata yawanci suna kaiwa yadudduka 20-30 kuma suna amfani da kayan asara marasa ƙarancin ƙarfi don haɓaka ƙimar samfuran gaba ɗaya.

Kamar yadda fasahar AI ke haɓaka cikin sauri, masana'antar PCB na fuskantar damar da ba a taɓa gani ba. Aikace-aikacen fasahar haɗin kai mai girma yana ƙara yaɗuwa, kuma manyan masana'antun suna haɓaka tsarin su don biyan buƙatun kasuwa na gaba da ƙalubalen fasaha. Manazarta kasuwa sun yi hasashen cewa buƙatun PCBs na sabobin AI yana canzawa gabaɗaya zuwa fasahar HDI, kuma ana tsammanin amfani da HDI zai ƙaru sosai a nan gaba.