Gida / Labarai / FPGA Babban Gudun PCB (Sashe na 2.)

FPGA Babban Gudun PCB (Sashe na 2.)

Tawada abin rufe fuska mai launin ja mai haske, farantin zinari + tsarin kula da saman yatsa na 30U', yana sa samfuran gabaɗayan su bayyana babban matsayi. Koyaya, abin da gaske ke jan hankalin mutane zuwa wannan samfurin ba kawai bayyanarsa ba ne, amma ƙirar sa mai sarƙaƙƙiya da ainihin tsarin masana'anta.

 

Da fari dai, bari in gabatar muku da ginin multilayer.

 

Tsarin tsari na al'ada da yawa ya ƙunshi yin amfani da fim ɗin PP (polyimide) wanda ba zai iya gudana ba don danna da laminate matakan. Koyaya, samfurinmu yana buƙatar yin aiki mai sauri, don haka gabaɗayan hukumar suna amfani da Panasonic's M6 jerin PCB mai saurin sauri. A halin yanzu, babu daidaitaccen PP wanda ba ya gudana akan kasuwa don M6, don haka dole ne mu yi amfani da PP mai gudana don lamination, wanda ke haifar da babban ƙalubale don samar da sassan mataki.

 

Samfurin kuma allon rami ne na inji mai Layer 18.

 

Mahaifiyar samfurin ta kasu kashi biyu ƙananan alluna, L1-4 da L5-18, don masana'anta, kuma samfurin ƙarshe ana yin su ta hanyar lamination guda uku. Laminating allunan Layer Layer yana da ƙalubale a zahiri, kuma idan yazo ga allon kayan masarufi na musamman, har ma da ɗan ƙaramin kuskure yayin lamination na iya haifar da cikakkiyar ɓarna ƙoƙarin!

 

A ƙarshe, don tabbatar da watsa siginar sauri mai sauri, rage girman sigina, tabbatar da ƙarfi da ingantaccen sigina, da kuma hana al'amurran da suka shafi karkatar da sigina, mun kuma haɗa fasahar haƙowa baya a cikin tsarin samar da samfur.

 

CKT-1 Dress daga saman Layer zuwa kasa Layer tare da zurfin 1.25+1-0.05, CKB-1 drills daga kasa Layer zuwa saman Layer tare da zurfin 0.35mm 1.45+/- 0.05, 0.351mm zurfin 1.25 + 1-0.05, 0.352mm zurfin 1.05+/-0.05, 0.353mm zurfin 0.2 + 1-0.05.

 

Idan kuna son ɗaukar PCB kamar wannan FPGA PCB, kawai danna maɓallin da ke saman don tuntuɓar mu don yin oda.

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