Gida / Labarai / Bincike akan Electroplating don PCBs HDI tare da Babban Halayen Ratio (Sashe na 1)

Bincike akan Electroplating don PCBs HDI tare da Babban Halayen Ratio (Sashe na 1)

 Bincike akan Electroplating for HDI PCBs tare da Babban Halayen Ratio (Sashe na 1)

Kamar yadda muka sani cewa, Tare da haɓakar haɓakar haɓakar sadarwa da samfuran lantarki, ƙirar allon da'irar da aka buga  azaman masu ɗaukar kaya shima yana motsawa zuwa manyan matakai da yawa. Manyan jirage masu yawa na baya ko uwayen uwa tare da ƙarin yadudduka, kauri mai kauri, ƙananan ramuka, da wayoyi masu yawa za su sami ƙarin buƙatu a cikin mahallin ci gaba da haɓaka fasahar bayanai, wanda ba makawa zai kawo babban ƙalubale ga hanyoyin sarrafawa masu alaƙa da PCB. . Tunda allunan haɗin haɗin haɗin kai mai girma suna tare da ƙirar ramuka tare da ƙima mai girma, tsarin plating dole ne ba kawai ya dace da sarrafa babban al'amari ta hanyar ramuka ba amma kuma ya samar da tasirin plating rami mai kyau, wanda ke haifar da ƙalubale ga kai tsaye na gargajiya. halin yanzu plating matakai. Matsakaicin babban al'amari ta ramuka tare da platin rami makaho yana wakiltar tsarin platining guda biyu, ya zama babban wahala a aikin platin.

 

Na gaba, bari mu gabatar da takamaiman ƙa'idodi ta hoton murfin.

Haɗin sinadarai da aiki:

CuSO4: Yana ba da Cu2+ da ake buƙata don electroplating, yana taimakawa wajen canja wurin ions na jan karfe tsakanin anode da cathode

 

H2SO4: Yana inganta tafiyar da aikin plating bayani

 

Cl: Taimakawa wajen samar da fim din anode da narkar da anode, yana taimakawa wajen inganta ajiya da crystallization na jan karfe

 

Additives Electroplating: Haɓaka kyau na plating crystallization da zurfin aikin plating

 

Kwatancen halayen sinadaran:

1. Matsakaicin ma'auni na ions jan karfe a cikin maganin sulfate na jan karfe zuwa sulfuric acid da hydrochloric acid yana rinjayar zurfin plating damar ta ramukan makafi.

 

2. Mafi girman abun ciki na jan karfe ion, mafi ƙarancin ƙarancin wutar lantarki na maganin, wanda ke nufin mafi girma juriya, yana haifar da rashin talauci na halin yanzu a cikin wucewa ɗaya. Saboda haka, don babban al'amari rabo ta-ramuka, a low jan karfe high acid plating tsarin da ake bukata.

 

3. Don ramukan makafi, saboda rashin kyaututtukan maganin da ke cikin ramukan, ana buƙatar babban adadin ions na jan karfe don tallafawa ci gaba da amsawa.

Saboda haka, samfuran da ke da babban yanayin ramuka da ramukan makafi suna ba da kwatance guda biyu masu adawa da wutar lantarki, wanda kuma ya ƙunshi wahalar aikin.

 

A cikin labari na gaba, za mu ci gaba da bincika ƙa'idodin bincike kan electroplating don PCBs HDI tare da ma'auni mai girma.

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