Yau, za mu gabatar da wani ɓangare na sharuɗɗan PCB SMT Stencil .

Sharuɗɗa da ma'anar da muka gabatar da farko suna bin IPC-T-50. An samo ma'anar ma'anar da alamar alama (*) daga IPC-T-50.

1.   Budewa: Buɗewa a cikin takardar stencil ta inda Ana ajiye man siyar a kan kwamfutocin PCB.

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3.   Iyaka: polymer ko bakin karfe da aka shimfiɗa a kusa da gefen takardar stencil, yin hidima don kiyaye takardar a cikin wani yanayi mai laushi da taut. Ramin yana kwance tsakanin takardar stencil da firam, yana haɗa su biyun.

4.   Solder Manna Rufe Shugaban Buga: Shugaban firintar stencil wanda yana riƙe, a cikin sassa guda ɗaya wanda za'a iya maye gurbinsa, ƙwanƙolin squeegee da ɗakin matsi mai cike da manna solder.

5.   Factor Factor: Ma'anar etch shine rabon etch zurfin zuwa na gefe etch tsawon lokacin da etching tsari.

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7.   Kunshin Sikeli mai Kyau BGA/Chip (CSP) : BGA (Ball Grid Array) tare da filin wasan ƙwallon ƙasa da ƙasa da 1 mm [39 mil], wanda kuma aka sani da CSP (Package Scale Package) lokacin da yankin fakitin BGA / yankin guntu bare shine ≤1.2.

8.   Fasahar Fine-Pitch (FPT)*: Dutsen saman saman fasaha inda nisan tsakiya-zuwa-tsakiyar tsakanin tashoshi masu siyar da abubuwa shine ≤0.625 mm [24.61 mil].

9.   Foils: Siraran zanen gado da ake amfani da su wajen kera stencils. .

10. Frame: Na'urar da ke riƙe da stencil a wurin. Firam ɗin na iya zama rami ko kuma an yi shi da simintin aluminium, kuma stencil ɗin ana kiyaye shi ta hanyar manne raga zuwa firam ɗin dindindin. Wasu stencil za a iya daidaita su kai tsaye a cikin firam ɗin tare da ƙarfin tashin hankali, waɗanda ke nuna rashin buƙatar raga ko madaidaicin madaidaicin don amintaccen stencil da firam.