Biyan labarai na ƙarshe, wannan labarin ya ci gaba da koyon ƙa'idodin karɓa don ingancin aikin abin rufe fuska na PCB.

Bukatun saman layi:

1.Ba a yarda da oxidation na Layer jan karfe ko sawun yatsa a ƙarƙashin tawada.

2. Ba a yarda da sharuddan da ke ƙarƙashin tawada:

①　Turare karkashin tawada mai diamita fiye da 0.25mm.

②　Tsarin da ke ƙarƙashin tawada wanda ke rage tazarar layi da 50%.

③　Fiye da maki 3 na tarkace a ƙarƙashin tawada kowane gefe.

④　Tsarin tarkace a ƙarƙashin tawada wanda ya ratsa tsakanin madugu biyu.

3. Ba a yarda da jajayen layin ba.

Bukatun BGA:

1.Ba a yarda tawada akan ma'aunin BGA ba.

2.Babu tarkace ko gurɓataccen abu da ke shafar solderability akan faifan BGA.

3. Dole ne a toshe ramuka a yankin BGA, ba tare da ambaton haske ko tawada ba. Tsayin abin da aka toshe ta hanyar bai kamata ya wuce matakin ma'aunin BGA ba. Bakin wanda aka toshe ta bai kamata ya nuna ja ba.

4.Ramuka da ƙãre diamita na 0.8mm ko mafi girma a cikin BGA yankin (ventilation ramukan) ba bukatar a toshe, amma fallasa tagulla a bakin ramin ba a yarda.